IDG-202X/IXZ-202X Family: World’s smallest and lowest profile dual-axis Gyroscopes for Optical Image Stabilization

Overview

The next generation family of dual-axis gyroscopes from InvenSense was designed specifically to address the market needs for optical image stabilization (OIS) in Smartphones. Smartphones are rapidly replacing digital still cameras (DSC) as the devices of choice for capturing images; however, their image quality has generally been worse than DSCs due to blurry images, especially those taken in low-light conditions. By incorporating OIS technology, the same method adopted by many digital still camera manufacturers, Smartphone image quality can be dramatically enhanced.

One of the major challenges of incorporating OIS technology into Smartphone’s has been the availability of high performance, small size, and low cost MEMS gyroscopes. InvenSense is the first company to deliver both x-y (roll and pitch) and x-z (roll and yaw) dual-axis MEMS gyroscopes in a very small 3x3x0.75 mm form factor that meets the market demand. The new gyroscopes also incorporate a range of high performance features, including16-bit Analog to Digital Converters, less than 6mW of power consumption, and 27kHz drive frequency.

This new dual-axis OIS family is available in two package sizes to suit two separate market needs. The IDG-2020/IXZ-2020 in 3x3x0.9mm QFN packages are targeted toward Digital Still Cameras where the IDG-2021/IXZ-2021 in a lower profile 3x3x0.75mm will specifically address the Camera phone module with OIS where size and profile of the module are the #1 consideration for design wins. Both families share the optimized electrical parameters for OIS application that separates them from motion processing application gyroscopes.

By leveraging the company’s patented Nasiri-Fabrication process, the key technology which enables direct integration of MEMS mechanical structures with CMOS electronics at the wafer level, the IDG-202X (x-y axis) and IXZ-202X (x-z axis) provide simple yet high performance solutions. The new gyroscopes offer features specifically tailored to meet OIS requirements, including the ability to have a factory full-scale output of ±31dps for highest sensitivity to detect slightest hand jitter, high-performance 32kHz ADC sampling, a nominal drive frequency of 27kHz, making the gyroscopes immune to interference from audible frequencies such as music or ambient noise, on-chip high resolution ADCs, low phase delay digital filters, and a high speed 20MHz SPI serial interface.

IDG-202X/IXZ-202X System Diagram

Applications

Markets

  • Smartphones
  • Tablet cameras
  • Digital Still and video cameras

Features

  • Dual-axis angular rate sensor (gyro) with a sensitivity of up to 262 LSBs/dps and a full-scale range of ±31, ±65, ±125, and ±250dps
  • High resolution ADCs for digitizing sensor outputs
  • Very low Rate noise at 0.0065 dps/√Hz
  • Low phase delay digital low pass filters designed for OIS
  • Fast sampling ADCs at 32KHz for precision hand jitter tracking
  • Nominal drive frequency of 27kHz, immune to ambient noise
  • Digital-output temperature sensor
  • Digital input on FSYNC pin and Integrated 512-byte FIFO support for video Electronic Image Stabilization
  • VDD Supply voltage range of 1.71V–3.6V with independent VDDIO
  • Gyro operating current: 2.9mA (full power, gyro at all rates)
  • Full Chip Idle Mode Supply Current: 5µA
  • Digital-output through 400kHz Fast Mode I2C or high speed read out SPI interface at 20MHz
  • User self test
  • 16-pin QFN package
  • 10,000g shock tolerant
Part # Full Scale Range (FSR) Sensitivity Digital Output Operating Voltage Supply Package Size Documentation Evaluation Board (EVB) Purchase Device
UNITS: (°/sec) (LSB/°/sec) (V) (mm) (.pdf) (add to cart) (add to cart)

IDG-2020
±31.25
±62.5
±125
±250
262
131
65.5
32.8
I²C
SPI
1.71 to 3.6 3x3x0.9 Product Spec Register Map
Evaluation Board Guide App Note

IXZ-2020
±31.25
±62.5
±125
±250
262
131
65.5
32.8
I²C
SPI
1.71 to 3.6 3x3x0.9 Product Spec Register Map Evaluation Board Guide

  • Disclaimer

    • InvenSense sensors should not be used or sold in the development, storing, production and utilization of any conventional or mass-destructive weapons or any other weapons or life-threatening applications as well as in any other life-critical applications including but not limited to medical equipment, transportation, aerospace and nuclear instruments, undersea equipment, power plant equipment, disaster prevention and crime prevention equipment. In devices or systems whereby malfunction of these products can be expected to result in personal injury and casualties, InvenSense customers using or selling these products do so at their own risk and agree to keep InvenSense harmless from any consequences. InvenSense reserves the right to make changes to this product, including its circuits and software, in order to improve its design and/or performance, without prior notice. InvenSense makes no warranty, either expressed or implied with respect to any product, and specifically disclaims all other warranties, including warranties for merchantability, non-infringement, and fitness for any particular purpose. For more information go to Terms and Conditions.

The Future of Sensor System on Chip