MPU-3000 Triple Axis Gyroscope with Embedded Digital Motion Processor™


InvenSense Triple Axis Gyroscope with Embedded Digital Motion Processor

The MPU-3000™ family of Motion Processing Units™ features the industry’s first 3-axis gyroscope with an embedded Digital Motion Processor™ (DMP) hardware accelerator engine. Today’s multi-purpose smart phones require a small, low-power gyro to provide wide bandwidth for motion-based gaming as well as high sensitivity and low noise performance for navigation assistance, video and still image stabilization and accurate gesture user interface control. The MPU-3000 provides a series of industry first features for complete motion processing in smart phones including the widest range of motions from 250 to over 2000°/sec, built-in 16-bit ADCs, programmable digital filters, factory calibration to 1% sensitivity, built-in 6-axis MotionFusion™ and 13mW power consumption.

With a 4x4x0.9mm footprint and I²C or SPI digital interfaces, the MPU-3000 MotionProcessor™ family is the first of its kind to address handset requirements. The MPU-3000 extends the traditional inertial sensor architecture with the industry’s first embedded DMP, together with an embedded FIFO, which offloads high-frequency motion algorithm computation from the host application processor, reducing interrupts and host MIPS to improve overall system performance.

The MPU-3000 also integrates a secondary I²C interface to link an external accelerometer to the DMP, another first in the market. This enables the DMP to perform 6-axis MotionFusion by integrating output from the gyroscope and accelerometer and report quaternion output to the handset application processor, offloading the host from sensor timing synchronization and MotionFusion computation. Other features of the MPU-3000 include internal clock generation, an embedded temperature sensor, programmable interrupts, and an FSYNC pin for synchronizing image, video and GPS data.

For power supply flexibility, the MPU-3000 has a separate VLOGIC reference pin in addition to its analog supply pin, which sets the logic levels of its I²C interface. The VLOGIC voltage may be anywhere from 1.71V minimum to VDD maximum.

The patented and volume-proven Nasiri-Fabrication™ platform enables highly scalable MEMS fabrication and wafer-level packaging by integrating MEMS and CMOS on a single silicon wafer. This wafer-level integration enables the industry’s lowest noise specification of 0.01%/√Hz, lowest power consumption, and smallest package size at the lowest possible cost.

3-Axis Motion Processing Solution Comparison Matrix

Applications supported by the InvenSense Triple Axis Gyroscope with Embedded Digital Motion Processor


  • Smallest and thinnest 4x4x0.9mm QFN package for portable devices
  • 6-axis MotionProcessing™ capability using secondary I²C interface to link an external accelerometer
  • Digital Motion Processing (DMP) engine supports 3D motion processing and gesture recognition algorithms
  • Programmable digital high-pass and low-pass filters support for each motion processing application
  • MotionApps™ Platform support for Android™, Linux™, Windows™, and Windows Mobile™ platforms.
  • Digital-output X-, Y-, and Z-Axis angular rate sensors (gyros) on one integrated circuit with a full-scale range of ±250 to ±2000°/sec
  • FIFO buffers complete data set, reducing timing requirements and interrupts on the applications processor
  • Programmable interrupt support features including gesture recognition, panning, zooming, scrolling, zero-motion detection, tap detection, and shake detection
  • 10,000 g shock tolerant
  • Low 6.1mA operating current consumption
  • Three integrated 16-bit ADCs provide simultaneous sampling of gyros
  • Digital-output temperature sensor

6-Axis System Diagram

Block Diagram of the InvenSense Triple Axis Gyroscope with Embedded Digital Motion Processor
Part # Full Scale Range Sensitivity Rate Noise Output Operating Voltage Supply Package Size PDF Documentation Software Gyro Evaluation Board ARM Interface Board Gyroscope
UNITS: (°/sec) (LSB/°/sec) (dps/√Hz) (V) (mm) (.pdf) (.zip) (add to cart) (add to cart) (add to cart)

0.01 SPI, I²C 2.1 to 3.6 4x4x0.9
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  • Disclaimer

    • InvenSense sensors should not be used or sold in the development, storing, production and utilization of any conventional or mass-destructive weapons or any other weapons or life-threatening applications as well as in any other life-critical applications including but not limited to medical equipment, transportation, aerospace and nuclear instruments, undersea equipment, power plant equipment, disaster prevention and crime prevention equipment. In devices or systems whereby malfunction of these products can be expected to result in personal injury and casualties, InvenSense customers using or selling these products do so at their own risk and agree to keep InvenSense harmless from any consequences. InvenSense reserves the right to make changes to this product, including its circuits and software, in order to improve its design and/or performance, without prior notice. InvenSense makes no warranty, either expressed or implied with respect to any product, and specifically disclaims all other warranties, including warranties for merchantability, non-infringement, and fitness for any particular purpose. For more information go to Terms and Conditions.

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