IXZ-500 Integrated Dual-Axis Gyroscope

Overview

The IXZ™ family of dual-axis MEMS gyroscopes feature the world’s first pitch/yaw (X and Z-axis) MEMS gyros that meet the in-plane mounting requirements of remote controls and interactive game controllers for digital TVs, IPTVs, set top boxes, media centers and PCs. Traditionally, designers of remote controls have had to use two single Z-axis or one dual-axis X/Y gyroscope,  which because of their axes of sensitivity, required a daughter card for mounting the angular rate sensors perpendicular to the rest of the system electronics.  The in-plane mounting of the IXZ family overcomes this limitation, enabling compelling form-factor designs.  

The IXZ-500 is uniquely suited for motion-controlled menu-navigation applications.  The device features a primary output with a ±500°/sec full scale range, for measuring higher speed motions, and has a secondary output with a ±110°/sec full-scale range, for sensing more precise movements.  These dual outputs allow the system designer to use an analog-to-digital-converter (ADC) with two fewer bits, saving overall system cost.

The IXZ-500 leverages InvenSense’s patented and volume-proven Nasiri-Fabrication platform, which integrates MEMS wafers with companion CMOS electronics through wafer-level bonding to produce a functionally complete, low-cost motion sensor.  All required conditioning electronics are integrated into a single chip measuring 4x5x1.2mm.  It incorporates X- and Z-axis low-pass filters and an EEPROM for on-chip factory calibration of the sensor.  Factory trimmed scale factors eliminate the need for external active components and end-user calibration.  A built-in Proportional-To-Absolute-Temperature (PTAT) sensor provides temperature compensation information.  The product is RoHS and Green Compliant.

The device leverages InvenSense’s patented and proprietary Nasiri-Fabrication design and manufacturing platform, where the MEMS and CMOS control electronics are bonded and hermetically sealed, allowing direct electrical interconnections and testing at the wafer level.  This approach minimizes parasitic capacitance and improves signal-to-noise ratios versus competitive solutions.

Applications

• 3D Remote Controls
• 3D Mice

Features

• Integrated X- and Z-axis gyros on a single chip with in-plane mounting
• Two separate outputs per axis for higher speed motions and lower-speed precise movements:
  • 500°/s full scale range (higher speed)
  • 110°/s full scale range (high precision)
• Integrated amplifiers and low-pass filters
• Auto Zero function for bias calibration
• On-chip temperature sensor
• High vibration rejection over a wide frequency range
• High cross-axis isolation by proprietary MEMS design
• 3V single supply operation
• Hermetically sealed for temp and humidity resistance
• 10,000 g shock tolerant
• Smallest dual axis gyro package at 4 x 5 x 1.2mm
• RoHS and Green Compliant

Benefits

•  World’s smallest dual-axis gyro sensor
•  Highest dynamic range to measure fast-action motion
•  Integrated electronics for complete signal conditioning
•  Lowest cross-axis sensitivity for best signal accuracy
•  Hermeticity for high temperature & humidity resistance
•  Most robust design for high impact consumer electronics
•  Compatible with standard SMT assembly processes